Saturday, February 18, 2006

3. Steady-state cracking in brittle substrates beneath adherent films

Z. Suo and J. W. Hutchinson, Steady-state cracking in brittle substrates beneath adherent films. International Journal of Solids and Structures, 25, 1337-1353, (1989).

A crack in a brittle substrate parallel to the film/substrate interface is considered. Stress intensity factors are obtained as a function of film/substrate thickness, elastic properties and edge loads at arbitary crack depth. These results, combined with the criterion K sub II = 0, are used to predict the steady-state cracking depth. The critical combination of residual stress and film thickness below which steady-state substrate cracking is avoided can be inferred provided the substrate toughness is known.

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